Substrates Materials: 96% AL2O3, IMS(insualted metal substrate)
High Speed Printing Systems
Minimal Conductor widths & distances: 0.18mm
Through Hole Printing
Minimal Via: 0.20mm
Multi-layer Construction: up to 20 layers
Printer thick film resistors value: 0.1ohm to 300megohm
TCR: <¡À100 ppm, with tracking TCR's to 20 ppm
Resistor Power ratings: 1/16 to 50 Watts


Laser Trimming Systems
Trimming tolerance:
0.5%(absolute), 0.1%(Ratio Matching)
Active Trimming:
Frequency, Voltage, Current, etc.
Assembly Technology:
SMT & Chip-On-Board
High Speed STM Systems
Minimal size:
0402
Lead Format:
SIP/DIP/SMC/QFP/Customized
Testing:
100% functional testing

 

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